Products & Services
The PATENTED VADU Series is the ideal solution for your void free soldering/bonding process.
• Direct CONTACT Heat Transfer
• Full Process Control, IPC-JEDEC Standards compliance
• Flux free soldering with Pre-forms material
• Solder Paste Process, with Flux Management System
• In-line high throughput production solution
• Process Gas(es) H2+N2, H2, FORMIC ACID
• Process Temperature up to 400°C
PLASMA SYSTEM
We offer plasma cleaning, activation and etching systems for various customizable applications.
• SEMICONDUCTOR => Plasma Process for leadframe, substrate and wafer before Die Bonding, Wire Bonding, Encapsulation/Molding etc.
• AUTOMOTIVE => Plasma Process for Plastic Housing before adhesion.
• MEDICAL =>Plasma Process for cleaning of Plastic, Glass Surface before adhesion.
• OTHERS => Plasma Process for Jewelry for surface preparation before adhesion.
• Types of Plasma: Microwaves, RF and Kilohertz.
• Types of Handling: Batch, In-line, Reel to Reel and many other customized solutions.
DIE BONDER/DISPENSER/MICRO-ASSEMBLY EQUIPMENT
We offer state-of-the-art precision equipment for the following applications:-
• Flip Chip Bonder/ Die Bonder…sub-micron accuracy
• SMD component Pick & Place…possible with standard tape feeder
• Odd shape components Pick & Place…with special customized feeder
• Dispensing of Conductive Paste, Solder Paste, Silicon Glue, UV Material, Adhesive, Thermal Grease, Encapsulation Material etc…with JET VALVE, PRECISION AUGER VALVE, POSITIVE DISPLACEMENT VALVE and etc.
• Fully Automated ALL-IN-ONE systems for Micro-Assembly.
SCANNING ACOUSTIC MICROSCOPE
We offer Semiconductor Scanning Acoustic Microscope for all ICs packaging, leadframes, wafers and etc.
• Customized full-automatic loader and unloader for inline systems
• Check for microcracks, delamination, bumps, cracks, voids and etc
• Customized Fixture according customer’s product layout
• Easy and user friendly software
POWER DEVICE TESTING EQUIPMENT
We offer Semiconductor Test Systems for IGBT, MOSFET, SCR, DIODE and similar, including Dynamic and Static Systems.
• Full-automatic test systems with data loggings
• Versatile Software Environment allows easy set up of test programs
• Customized Fixture according customer’s product layout
• Easy exchange of tooling
INSPECTION SYSTEM
We offer Automated Optical Inspection Systems (AOI) and Automated X-ray Inspection (AXI) System.
• Inspection of Soldering Quality of Component Joints on PCB, BT SUBSTRATES and CERAMIC.
• Fully automatic inspection program.
• SPC Software
• Off-line Programming
• Rework Station
We offer IR Wavelengths Inspection system for SEMICONDUCTORS.
• Inspection of bare wafers, chips, MEMS, wafer bonds, SOI and Flip Chip.
• Wafers can be composed of various materials: silicon, gallium arsenide, III-V materials and others
• Inspection process for MEMS facilitates structural analysis and examination for foreign bodies
Products
Vacuum Oven
Plasma System
Die Bonder/Dispenser/
Micro-Assembly Equipment
Scanning Acoustic Microscope
Power Device Testing Equipment
Inspection System