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VADU 300XL2019-01-15T20:10:49+00:00

Inline soldering system VADU 300XL

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Automated soldering with vacuum

The soldering system VADU 300XL is equipped with three separate process chambers with internal substrate handling and inline carrier transfer for highly efficient series production. The system enables void-free solder connections with preforms and /or pastes in a continuous process.

The reproducibility of the soldering processes is guaranteed by permanent process control. The VADU 300XL can also be integrated in customer‘s automation processes.

PINK develops solutions according to customer‘s requirements which range from the optimization of the carrier handling through surrounding transfer systems to connection with pick-and-place machines and robot automation.

System features

  • Void-free solder connections

  • Soldering with preforms and / or pastes

  • Individual soldering profiles

  • Process temperatures up to 400 °C

  • Controlled temperature gradients

  • Short cycle times

  • Separate soldering and cooling chamber

  • Flux-free soldering with formic acid

  • Flux management

  • Inert gas atmosphere

  • Residual oxygen content < 5 ppm

  • Reproducibility of the soldering results

  • Traceability

  • Permanent process control

  • Ethernet interface

  • Remote maintenance (VPN)

  • Low energy and media consumption

  • Internationally patented system

Type of system Inline System
Number of vacuum chambers 3 chambers
Process area (W x D) 410 x 280 mm
Clearance height max. 100 mm
Vacuum (standard) ≤ 2 mbar
Dimensions of the system (W x D x H) 2,340 x 1,760 x 1,800 mm
Dimensions of pumping unit 1,000 x 700 x 1,800 mm
Weight 2,000 kg (without pumping unit)
Power supply 3 x 400 V, 50/60 Hz
Power input 25 kVA
SMEMA interface
Options:
Wafer Up to 12 “
Induction heating
Handling / Transfer systems
High vacuum