Soldering system VADU 200XL-W (Wafer)
Vacuum supported soldering of wafers up to 12″
The soldering system of type VADU 200XL-W is equipped with two separate process chambers and can be operated with paste as well as preforms. The VADU 200XL -W enables the soldering of wafers up to 12″.
PINK also produces customized carriers for this system so that it allows the precise control of all relevant process parameters, e.g. the temperature gradients during heating and cooling.
Due to its intelligent temperature management the system provides short cycle times and an excellent temperature stability.
System features
Void-free solder connections
Soldering with preforms and/or pastes
Individual soldering profiles
Process temperatures up to 400 °C
Controlled temperature gradients
Short cycle times
Separate soldering and cooling chamber
Flux-free soldering with formic acid
Flux management
Inert gas atmosphere
Residual oxygen content < 5 ppm
Reproducibility of the soldering results
Traceability
Permanent process control
Ethernet interface
Remote maintenance (VPN)
Low energy and media consumption
Internationally patented system
| Type of system | Batch system |
| Number of vacuum chambers | 2 chambers |
| Process area (W x D) | 410 x 280 mm |
| Clearance height | max. 100 mm |
| Vacuum (standard) | ≤ 2 mbar |
| Dimensions of the system (W x D x H) | 1,200 x 2,110 x 1,700 mm |
| Dimensions of pumping unit | Integrated |
| Weight | 1,200 kg |
| Power supply | 3 x 400 V, 50/60 Hz |
| Power input | 10 kVA |
| SMEMA interface | – |
| Carriers | Wafer up to 12″ |
| Options: | |
| Induction heating | √ |
| Handling/Transfer systems | √ |
| High vacuum | √ |