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Vacuum Soldering System2019-01-15T15:26:54+00:00

Vacuum Soldering System

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Originally driven by Power Device application, void free soldering has become the non negotiable requirement of reliable soldering joint. Today we have seen this requirement spread over to other non-power device application, a sign of market recognition of the importance of Vacuum Soldering Technology.

We have solutions which are derived from more than 30 years of vacuum soldering technology…both with and without flux.

Soldering Technology – System for void-free soldering with vacuum – Vacuum-soldering for high-quality production

The power density of advanced electronic components like e.g. power modules, hybrid and multichip components, etc. is continuously growing. Therefore, the quality of solder connections must fulfill the increasing demands as well. Gas inclusions (= voids) in the solder connections must be avoided.

The best way to remove such from the liquid solder is the systematic use of vacuum during the soldering process.

The vacuum soldering systems by PINK provide void-free solder connections, e.g. of large power modules, with preform solders and / or pastes in a continuous process.

System features

  • Void-free solder connections
  • Soldering with preforms and /or pastes
  • Individual soldering profiles
  • Process temperatures up to 400 °C
  • Controlled temperature gradients
  • Short cycle times
  • Separate soldering and cooling chamber
  • Flux-free soldering with formic acid
  • Flux management
  • Inert gas atmosphere
  • Residual oxygen content < 5 ppm
  • Reproducibility of the soldering results
  • Traceability
  • Permanent process control
  • Ethernet interface
  • Remote maintenance (VPN)
  • Low energy and media consumption
  • Internationally patented system

Advantages of the VADUs

  • Short cycle times and high performance by intelligent temperature management
  • Environment-friendly and easy to operate due to a smart design
  • Flexible soldering technologies for individual customer demands
  • Perfect and reproducible soldering results due to a continuous process control
Batch system
1 chamber
Clearance height max. 50 mm
Dimensions: 1.070 x 1.400 x 1.150 mm
Batch system
2 chambers
Clearance height max. 100 mm
Dimensions: 1,200 x 2,110 x 1,700 mm

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Batch system
2 chambers
Clearance height max. 100 mm
Dimensions: 1,200 x 2,110 x 1,700 mm
Batch system
3 chambers
Clearance height max. 100 mm
Dimensions: 2,340 x 1,760 x 1,800 mm

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 Inline System
 4 chambers
Clearance height max. 100 mm
Dimensions: 3,020 x 1,660 x 1,800 mm

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PINK Automation

Fully customized automation soldering solutions by Pink

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Carriers

For maximum productivity and cost-efficiency