Originally driven by Power Device application, void free soldering has become the non negotiable requirement of reliable soldering joint. Today we have seen this requirement spread over to other non-power device application, a sign of market recognition of the importance of Vacuum Soldering Technology.
We have solutions which are derived from more than 30 years of vacuum soldering technology…both with and without flux.
Soldering Technology – System for void-free soldering with vacuum – Vacuum-soldering for high-quality production
The power density of advanced electronic components like e.g. power modules, hybrid and multichip components, etc. is continuously growing. Therefore, the quality of solder connections must fulfill the increasing demands as well. Gas inclusions (= voids) in the solder connections must be avoided.
The best way to remove such from the liquid solder is the systematic use of vacuum during the soldering process.
The vacuum soldering systems by PINK provide void-free solder connections, e.g. of large power modules, with preform solders and / or pastes in a continuous process.