In the photovoltaic industry our welding systems are, for example, used for joining busbars to metal-coated glasses. CIS, CIGS, CdTe, a-Si and µc-Si thin-film modules, among others, are all well-suited for this method.
It is precisely in these highly-sensitive applications that this process represents the highest degree of quality and optimal connection properties. By avoiding the use of filler material such as solder or glue, ultrasonic welding achieves a tight substance-to-substance bond with outstanding electrical and mechanical properties.
In addition to the excellent conductivity of ultrasonically-welded modules and the reduced thickness of the busbar when compared to soldering or gluing, the significantly lower production costs are a further important criterion.