Printed circuit board (PCB) – usually part of the PCB assembly process after reflow:
AXI is the best technology for accurately reconstructing the shape of solder balls and fillets to perform reliable solder inspection.
Saki’s AXI systems don’t just inspect, they combine the layers, measure components and features, determine placement variance and warpage, and analyze their internal structures for a true volumetric representation of continuous 3D images without joints. Saki’s BF-X3 system offers a programmable resolution from 13–30 microns. Reconstruction of images is done on-the-fly, for every solder joint, creating 3D data for the entire sample. Defects are identified and classified, including 100% of head-in-pillow defects, voids, and dry joints. This results in best-in-class Cpk and gage repeatability and reproducibility, which is particularly critical in aerospace, medical, automotive, and other applications where failure is not an option.
High-resolution 3D data is used for all image acquisition, inspection, and analysis. A high-resolution image of each defect is displayed immediately, thereby enabling prompt viewing and analysis and eliminating the need for further analytical equipment. Such precision machine control, 3D reconstruction, 3D inspection, and 3D viewing are all unique developments by Saki.