Die Bonder / Dispenser / Micro-Assembly Equipment
Our supplier designs, produces and delivers highest accuracy positioning systems for the automatic execution of precision processes with the comprehensive component matrix: PLATFORMS - ASSEMBLY - DISPENSE - FEEDER.
Desktop factory
- Jet/Time-Pressure dispenser
- Syringe presence control
- Needle calibration
- Height measure sensor
- SMD-Assembly
- Pick from wafer, die and flip chip
- Wafer map import
- Gel-Pak support
- Relative assembling
- Substrate heater
- Board carrier
Production line
- Component mount
- WPC Transport system
- ID-Inspection
- Host communication
- Component tox process
- Component test
- Component calibration
- Laser writing
- Plain writing inspection
- Product unload
- Traceability software
- Tool less change over
Pneumatically operated High-speed Valve for none-contact jet dispensing of media with high viscosity.
The Micro-dispensing Valve P-Dot is designed for none-contact dispensing of adhesives, silicones, lacquers, oils and greases. Because of its extreme short triggering time (<= 1ms), it allows the application of smallest quantities of high viscosity media at distances ranging from 2 to 40 mm with pin point precision. The amount of fluid, possible to be dispensed, can be varied between 10 and 200 nl per triggering. Depending on the medium, dot sizes of a minimum of 350 nm up to 2000 nm can be realized.